Electronics

Services

• Applied research focused on protective clothing, e.g. particularly for firefighters, and smart textile products for patients, convalescents, seniors, and individuals requiring specialized care
• Professional protective clothing with integrated functional electronic systems (gas concentration monitoring, temperature and humidity measurement, active lighting, acoustic alarms, posture and position detection, wireless data transmission)
• Protective gloves and footwear with integrated functional electronic systems (ambient and remote temperature measurement, voltage presence detection, wireless power and data transfer, active lighting)
• Functional base layers and garments with embedded electronic components for ECG monitoring, heart and respiration rate measurement, temperature and humidity sensing, and active heating
• Encapsulation and integration of functional electronic blocks into textiles
• Electrical characterization of electronic components and materials in DC and AC domains, including high frequencies up to 3 GHz

Equipment

• Bernina 750 QE Sewing and Embroidery System:
• Dual-feed fabric mechanism supporting basic, stretch, overlock, decorative, and quilting stitches
• 872 stitch patterns
• 11 needle positions
• Continuously adjustable sewing speed up to 1,000 stitches per minute
• Maximum embroidery area: 40 × 26 cm
• Garment Assembly Equipment:
• 5-thread coverlock and overlock sewing machine with jet-air threading
• Nicomatic crimping system
• Sunko 709A resistance spot welding station
• EKRA E2 semi-automatic screen printing machine
• DC Measurement Equipment:
• Keithley precision DC instrumentation (source measure units / SMUs, femtoammeters, nanovoltmeters, multichannel DMMs)
• RF / High-Frequency Measurement Equipment:
• Agilent RLC meter (frequency range: 1 MHz – 3 GHz)
• Agilent spectrum analyzer with tracking generator (frequency range: 9 kHz – 3 GHz)
• Agilent RF signal generator (frequency range: 9 kHz – 3 GHz)
• Signal integrity analyzer (frequency range: DC to 30 GHz)

Services

• Assessment of acceptability criteria for electronic assemblies according to IPC-A-610
• Assessment of acceptability criteria for printed circuit boards according to IPC-A-600
• Diagnostics of active and passive electronic components
• IC decapsulation (chip decapsulation)
• Diagnostics of solder joint defects
• Solderability testing of PCBs and components (Dip and Look Test, Wetting Balance Test, solder spreadability test for vapor phase soldering)
• Ionic contamination measurement on bare (unpopulated) and assembled (populated) PCBs
• Ionic contamination measurement on components
• Diagnostics of mechanical failures (fractures, cracks)
• X-ray and Computed Tomography (CT) analysis of assemblies, PCBs, and components

Equipment

• Multicore MUST II solderability tester
• ASSCON Quicky 300 laboratory vapor phase soldering system
• Concoat CM11 ionic contamination meter (measurement range: 0.01–30 µg NaCl eq./cm², maximum board dimensions: 300 × 250 × 30 mm, minimum PCB surface area: 100 cm²)
• GE Phoenix v|tome|x s240 microfocus X-ray inspection system for 3D Computed Tomography (CT) including standard 2D inspection
• For more, see Image Analysis of Samples and Materialography

Services

• Selective deposition of functional materials using Aerosol Jet Printing (AJP), screen printing, and stencil printing
• Plasma and ozone surface treatment prior to material deposition (surface energy adjustment, cleaning, surface functionalization, and activation)
• Research on printed flexible sensors (gases and vapors, temperature, humidity, leakage, resin curing state), printed interconnect structures, and passive/active components (antennas, R, L, C, and OECTs – organic electrochemical transistors)
• Development of hybrid electronic circuits on flexible substrates
• Research on hybrid component assembly and interconnection of printed functional structures on flexible substrates (low-temperature soldering, conductive and non-conductive adhesive bonding, mechanical crimping, welding)
• Research on electronic components and sensors based on conductive carbon nanomaterials (CNTs, graphene)
• Research on eco-friendly green electronics (organic functional materials, cellulose substrates, energy-efficient and sustainable manufacturing processes)
• Electrical characterization of electronic components and materials in DC and AC domains, including high frequencies up to 3 GHz
• Design and simulation of planar components and circuits, signal transmission analysis, and design optimization

Equipment

• Optomec AJ300 Aerosol Jet Printing system
• EKRA E2 semi-automatic screen printing machine
• Relyon Plasma Plasmabrush PB3 plasma surface treatment system
• Laboratory furnaces and ovens for thermal processing and material curing
• Vötsch environmental chambers for environmental testing (temperature, humidity, thermal shock, vibration, corrosive atmospheres)
• Keithley precision DC instrumentation (SMUs, femtoammeters, nanovoltmeters, multichannel DMMs)
• RF / High-Frequency Measurement Equipment:
  • Agilent RLC meter (frequency range: 1 MHz – 3 GHz)
  • Agilent spectrum analyzer with tracking generator (frequency range: 9 kHz – 3 GHz)
  • Agilent RF signal generator (frequency range: 9 kHz – 3 GHz)
  • Signal integrity analyzer (frequency range: DC to 30 GHz)
  • Function generator (frequency range: up to 120 MHz)
• Simulation Tools:
  • Ansoft Designer: simulation of conductive interconnect parameters, materials, and process modifications; parametric analyses
  • HyperLynx: identification of critical PCB areas and solution design (LineSim and BoardSim modules, EMC-compliant design)

Services

• Selective deposition of functional materials using Aerosol Jet Printing (AJP), screen printing, and stencil printing
• Plasma and ozone surface treatment prior to material deposition (surface energy adjustment, cleaning, surface functionalization, and activation)
• Research on printed flexible sensors (gases and vapors, temperature, humidity, leakage, resin curing state), printed interconnect structures, and passive/active components (antennas, R, L, C, and OECTs – organic electrochemical transistors)
• Development of hybrid electronic circuits on flexible substrates
• Research on hybrid component assembly and interconnection of printed functional structures on flexible substrates (low-temperature soldering, conductive and non-conductive adhesive bonding, mechanical crimping, welding)
• Research on electronic components and sensors based on conductive carbon nanomaterials (CNTs, graphene)
• Research on eco-friendly green electronics (organic functional materials, cellulose substrates, energy-efficient and sustainable manufacturing processes)
• Electrical characterization of electronic components and materials in DC and AC domains, including high frequencies up to 3 GHz
• Design and simulation of planar components and circuits, signal transmission analysis, and design optimization

Equipment

• Optomec AJ300 Aerosol Jet Printing system
• EKRA E2 semi-automatic screen printing machine
• Relyon Plasma Plasmabrush PB3 plasma surface treatment system
• Laboratory furnaces and ovens for thermal processing and material curing
• Vötsch environmental chambers for environmental testing (temperature, humidity, thermal shock, vibration, corrosive atmospheres)
• Keithley precision DC instrumentation (SMUs, femtoammeters, nanovoltmeters, multichannel DMMs)
• RF / High-Frequency Measurement Equipment:
  • Agilent RLC meter (frequency range: 1 MHz – 3 GHz)
  • Agilent spectrum analyzer with tracking generator (frequency range: 9 kHz – 3 GHz)
  • Agilent RF signal generator (frequency range: 9 kHz – 3 GHz)
  • Signal integrity analyzer (frequency range: DC to 30 GHz)
  • Function generator (frequency range: up to 120 MHz)
• Simulation Tools:
  • Ansoft Designer: simulation of conductive interconnect parameters, materials, and process modifications; parametric analyses
  • HyperLynx: identification of critical PCB areas and solution design (LineSim and BoardSim modules, EMC-compliant design)

Services

• R&D focused on specialized substrates for power applications and component interconnection technologies
• Firing processes in protective nitrogen or argon atmospheres up to 1,100 °C
• Design and fabrication of ceramic substrate samples with thick copper layers*
• Design and process optimization for direct printing of thick copper layers on ceramic substrates (Thick Print Copper – TPC technology)
• R&D into alternative interconnect technologies for power semiconductor dies (copper ribbon soldering, printed interconnections, sintering)
• Adhesion and delamination testing of copper layers
• Solderability and bondability testing of copper layers
• Quality analysis of void-free vacuum soldering of large-area semiconductor components
• Preparation of materialographic cross-sections

* Primarily utilizes Direct Bonded Copper (DBC) and Thick Print Copper (TPC) technologies. Conductive layer thickness reaches up to several hundred µm.

Equipment

• Muffle furnace with a gas-tight retort
• EKRA E2 semi-automatic screen printing machine
• Lauda PROLINE PJL 12 calibration thermostatic bath with DLK 45 cooling unit
• Multicore MUST II solderability tester
• K&S 4700 semi-automatic wire bonder / bonding station
• LABORTECH 3.030 testing machine for layer adhesion measurement (up to 1 kN)
• Thermal shock chamber (rapid transition: –80 °C to 220 °C)
• 180-liter environmental chamber (–70 °C to 180 °C, 10% to 98% RH)
• 600-liter environmental chamber (–70 °C to 180 °C, 10% to 98% RH) with combined climatic and vibration testing capabilities
• Corrosion test chamber (condensation and salt spray/salt fog testing)
• GE Phoenix v|tome|x s240 microfocus X-ray inspection system for 3D Computed Tomography (CT) including standard 2D inspection
• Olympus LEXT OLS5000 laser confocal microscope
• Phenom ProX SEM (scanning electron microscope) with EDX elemental analysis
• Keithley precision DC instrumentation (SMUs, femtoammeters, nanovoltmeters, multichannel DMMs)

Services

• R&D in chemiresistive gas sensors (e.g., NO₂, NH₃, CO) based on organic materials and carbon nanostructures
• R&D in electrochemical gas sensors (e.g., NO₂, NH₃, C₂H₄) based on polymer electrolytes
• Development and testing of sensors for heavy metal detection in water
• Development of fully printed sensor elements
• Topology design of electrode structures for sensor elements
• Deposition of electrode structures and sensing layers
• Electrical characterization of sensor elements and materials in DC and AC domains, including high frequencies up to 3 GHz
• Development of electronic readout and evaluation circuits for sensors

Equipment

• Computer-Controlled Gas Mixing Apparatus:
  • System equipped with seven mass flow controllers (Sierra Instruments)
  • Testing capability under controlled environments: variable relative humidity (20–80%), temperature (0–100 °C), analyte flow rates (0.2–1.5 L/min), and analyte concentrations from hundreds of ppb to hundreds of ppm
• PGSTAT204 Multichannel Potentiostat / Galvanostat with Electrochemical Impedance Spectroscopy (EIS)
• AC and DC Measurement Instrumentation: AC up to 3 GHz; DC precision equipment including SMUs, femtoammeters, nanovoltmeters, and multichannel DMMs
• Additive Deposition Equipment for Functional Materials:
  • EKRA E2 screen printing system
  • Optomec AJ300 Aerosol Jet Printing system
• Electrical Contacting and Interconnection Equipment:
  • Soldering (manual micro-soldering stations, inline reflow oven, vapor phase soldering)
  • Conductive and non-conductive adhesive bonding (thermal and UV curing)
  • Nicomatic crimping system
  • Sunko 709A resistance spot welding station

Services

• R&D of printed and textile sensor elements for temperature and relative humidity measurement
• R&D of large-area liquid leakage sensors for construction, agriculture, and industrial applications
• R&D of soil temperature and moisture sensors for agricultural applications, including nutrient detection
• Topology design of electrode structures for sensor elements
• Selective deposition of electrode structures and sensing layers on flexible and rigid substrates, including large-area carriers
• Research on sensor elements based on carbon nanoparticle materials (CNTs, graphene)
• Electrical characterization of sensor elements and materials in DC and AC domains, including high frequencies up to 3 GHz
• Development of electronic readout and evaluation circuits for sensors

Equipment

• Lauda PROLINE PJL 12 calibration thermostatic bath with DLK 45 cooling unit
• Vötsch environmental chambers for environmental testing (temperature, humidity, thermal shock, vibration, corrosive atmospheres)
• Laboratory furnaces and ovens for long-term thermal testing
• Keithley precision DC instrumentation (SMUs, femtoammeters, nanovoltmeters, multichannel DMMs)
• RF / High-Frequency Measurement Equipment:
  • Agilent RLC meter (frequency range: 1 MHz – 3 GHz)
  • Agilent spectrum analyzer with tracking generator (frequency range: 9 kHz – 3 GHz)
  • Agilent RF signal generator (frequency range: 9 kHz – 3 GHz)
  • Signal integrity analyzer (frequency range: DC to 30 GHz)
  • Function generator (frequency range: up to 120 MHz)
• Additive Deposition Equipment for Functional Materials:
  • EKRA E2 screen printing system
  • Optomec AJ300 Aerosol Jet Printing system
• Electrical Contacting and Interconnection Equipment:
  • Soldering (manual micro-soldering stations, inline reflow oven, vapor phase soldering)
  • Conductive and non-conductive adhesive bonding (thermal and UV curing)
  • Nicomatic crimping system
  • Sunko 709A resistance spot welding station

Services

• Spectrum analysis up to 7 GHz, RF or pulsed signal power measurement up to 18 GHz
• Receiver sensitivity measurement weighted by SNR, SINAD, BER, or other parameters; immunity testing against standard interfering signals and adjacent channel interference
• Transmitter parameter measurement, modulation depth, frequency deviation, and spurious/parasitic emission measurement up to 7 GHz
• Analysis of information-bearing or radiated interference signals up to 7 GHz, modulation type identification of unknown signals, vector signal analysis, signal distortion characterization, and origin identification of radiated signals
• Long-term radio spectrum recording, offline evaluation, signal parameter variation analysis over time, error rate/failure frequency analysis, record correlation, and communication protocol analysis
• Custom test and measurement signal generation up to 3 GHz
• Vector measurement of component impedance and transmission characteristics up to 8 GHz, frequency-domain and time-domain analysis, time-gated reflection analysis
• Measurement of antenna impedance and transmission properties, gain, directivity, and spurious/unwanted radiation
• Noise figure measurement up to 13 GHz, phase noise measurement of oscillators and signal generators

Equipment

• Rohde & Schwarz FSIQ 7 vector signal analyzer (20 Hz to 7 GHz)
• Rohde & Schwarz ZVB-8 vector network analyzer (300 kHz to 8 GHz)
• Agilent EXA N9010A spectrum analyzer (10 Hz to 13.6 GHz) with noise figure and phase noise measurement capability, noise generator
• Anritsu MS420B vector network analyzer (10 Hz to 30 MHz)
• Agilent ESA E4402B spectrum analyzer with tracking generator (100 kHz to 3 GHz)
• Agilent ESA E4402B high-resolution spectrum analyzer (5 kHz to 3 GHz)
• Rohde & Schwarz SMY-01 RF signal generator (9 kHz to 1.040 GHz)
• Rohde & Schwarz SM300 RF signal generator (9 kHz to 3 GHz)
• Rohde & Schwarz AM-300 baseband signal generator (100 MS/s)
• Panasonic VP8194D RF signal generator for AM/FM broadcast receiver testing, including RDS and auxiliary features
• EIDEN radio signal recording and generation system (modules: 4405A-001, 4222A-001, 5212B-002, 4406A-002)
• Software-defined radio (SDR) units: Ettus and National Instruments (USRP N-200, NI USRP 2920, E100)

Services

• Measurements on terrestrial and satellite digital TV (DVB) antenna signal distribution networks
• Measurement of individual active and passive component properties within signal distribution networks
• Measurement of BER, MER, QEF, and C/N parameters in signal distribution networks
• Analysis of constellation diagrams and signal quality across individual OFDM subcarriers
• Testing of set-top boxes and digital televisions under varying signal levels and quality conditions

Equipment

• Promax TV Explorer II+ digital television broadcast analyzer (DVB-T, DVB-S, DVB-S2, DVB-C formats, analog TV, and radio broadcasting)
• Promax RP-200 programmable pilot generator
• Rohde & Schwarz FSIQ7 signal analyzer
• Rohde & Schwarz ZVB8 vector network analyzer
• Auxiliary tools for laboratory antenna distribution network testing (noise generators, amplifier stations, EMP Centauri cascade multiswitches)
• Laboratory DVB-T and DVB-S signal distribution network for testing purposes
• DekTec DVB-T/T2 and DVB-S/S2 signal generators
• Alitronika AT780USB laboratory receiver

Services

• Restoration of historical gramophone/phonograph audio recordings
• Cleaning and decontamination of audio media, including inspection of physical and mechanical parameters
• Audio capture using specialized pickup systems and digitization of mechanical vinyl/shellac recordings with IEC S78 or RIAA equalization curves (supports rotational speeds from 16 to 78 RPM)
• Application of custom equalization curves for non-standard historical recording characteristics (e.g., CETRA, His Master's Voice, Columbia, Parlophone, DGG, Italia, NAB, NARTB, LGC)
• Quality control and technical parameter verification of digitized audio tracks
• Adaptive filtering, noise reduction, and suppression of acoustic artifacts caused by physical groove damage (de-clicking, de-crackling, and rumble/groove vibration removal)
• Audio export to CD-DA (16-bit) with CD-Text, DVD-Audio (24-bit), or uncompressed/lossless audio file formats (16-bit or 24-bit)

Equipment

• Professional audio technologies, playback, and restoration equipment from Ortofon, Technics, RME Audio, Steinberg, Sony, MRL, Philips, and OM&T

Services

• Analysis, testing, and measurement of technical parameters for low-frequency and audio equipment; measurements in analog, digital, and mixed/hybrid domains; multichannel measurements
• Analysis of devices with analog and digital interfaces (S/PDIF / TosLink, TDIF, ADAT, AES3 / AES-EBU, AES11, etc.)
• Performance measurement of low-frequency equipment, preamplifiers, and power amplifiers according to (ČSN) EN 61305 and (ČSN) EN 60268 standards up to 30 kW output power
• Measurement of technical parameters for digital audio sections in audio and audiovisual equipment according to (ČSN) EN 61606 (professional audio gear, consumer electronics, and PC audio subsystems); technical evaluation of A/D and D/A converters per AES specifications
• Quality measurement of speech transmission and processing in telecommunication systems using objective testing methods (PESQ, POLQA)
• Quality assessment of high-quality wideband audio transmission and processing — PEAQ (ITU-R BS.1387), prediction of subjectively perceived audio quality, and perceived audio loudness measurement (ITU-R BS.1770)
• Measurement of technical parameters for analog and digital recording devices (tape recorders, turntables, CD-DA systems, DVD-Audio, SACD, MiniDisc, MP3 recorders, HDD recorders, etc.) and audio stages of analog and digital TV and radio receivers

Equipment

• Measurement technology and systems from Audio Precision, Rohde & Schwarz, Dolby Laboratories, Prism Sound, RME Audio, Brüel & Kjær, Earthworks, Neutrik – NTI Audio, Agilent, Tektronix, National Instruments, OPTICOM, AFMG – SDA, MRL, Philips, and OM&T

Services

• Tracking of satellites in Low Earth Orbit (LEO), verification of orbital parameters via satellite radio beacon reception
• Satellite radio communication signal recording, passive extraction of basic telemetry from uncommanded satellite transmissions
• Active satellite communication: telecommanding (command uplink), managed data upload/download, telemetry collection, and scientific experiment data retrieval

Equipment

• RFHAMDESIGN 1.9 m parabolic dish antenna for the 2400 MHz band with a helical feed
• M2 Antenna Systems (MSQUARE) 436CP30 cross-Yagi antenna for the 435 MHz band (14.1 dBdc gain)
• M2 Antenna Systems (MSQUARE) 2MCP14 cross-Yagi antenna for the 145 MHz band (10.2 dBdc gain)
• ICOM IC-910H transceiver for 145, 435, and 1200 MHz bands, equipped with low-noise amplifiers (LNAs)
• AlfaSpid Big RAS dual-axis antenna rotator/positioner with upgraded MD-01 controller (azimuth and elevation control)
• Linux Debian-based host PC and software suite featuring satellite tracking, transceiver and positioner control interfaces, scripting environment, MySQL database, and local/remote user interfaces
• Auxiliary Equipment: Uninterruptible Power Supply (UPS), fiber-optic internet connection, hardware AX.25 Terminal Node Controller (TNC), universal software TNC, and GomSpace NanoCom TNC
• Experimental Equipment: Ettus USRP N-200 software-defined radio (SDR) and custom-hardware experimental radio for the 2400 MHz band

Services

• Development of control systems and electronics for transportation engineering and vehicle technology
• Development of control systems for the energy sector
• Development of power electronics applications featuring power converters
• Design of single-board control units (SBCs / controllers)
• Implementation of modular control systems in 19" rack form factors
• Development of systems utilizing high-speed communication interfaces (e.g., LVDS up to 1.3 Gbps, Ethernet, USB 2.0/3.0)
• FPGA design for Altera programmable logic devices, including custom architecture and utilization of platforms such as Avalon® Qsys
• Primary hardware platforms utilized: Hercules™ ARM® Safety microcontrollers; ST microcontrollers with ARM Cortex-M3/M4 cores; TI TMS320F28335, TMS320F28377
• Flexible collaboration options: expert consultations, contract research and development, innovation vouchers, and joint grant research projects

Equipment

• MSOX91304A high-frequency oscilloscope: 13 GHz bandwidth / 4 channels, sampling rate up to 80 GSa/s (2 channels), low-level noise floor measurement of 1.30 mVrms @ 13 GHz / 50 mV/div; compliance testing suite for USB 2.0/3.0, Ethernet, and DDR
• Rohde & Schwarz ESPI7 EMI test receiver: frequency range: 10 Hz to 7 GHz, resolution: 0.01 Hz, integrated tracking generator and I/Q modulator
• Keysight 16854A 136-channel precision logic analyzer: sampling rate: 2.5 GHz / 5 GHz (full / half channel), memory depth: 256 M
• Keithley 2401 single-channel parametric DC SourceMeter: voltage resolution: 5 µV, current resolution: 50 pA, max output: 20 V / 1 A
• Keysight E4980A precision LCR meter: basic accuracy: 0.05%, frequency range: 20 Hz to 2 MHz
• Keysight 33600A dual-channel function / arbitrary waveform generator: bandwidth: 120 MHz, sampling rate: 1 GSa/s
• ESSEMTEC EXPERT-LINE UP3100 semi-automatic SMD pick-and-place station: equipped with an optical alignment prism for BGA placement
• Software Suite: Altium Designer, MATLAB, Intel Quartus Prime, Atollic, Code Composer Studio, SolidWorks

Services

• Development of modular test systems for electronic device testing
• Selection and assembly of control/host computers, along with the design of test system subsystems based on the chosen platform
• Development of test plans, implementation, and optimization of specific test routines tailored to device specifications
• Adaptation of the universal RATS interconnection/routing platform based on signal counts and types, including signal conditioning module design
• Development of custom, application-specific modules
• Integration of external measurement instruments into the test system
• Flexible collaboration options: expert consultations, contract research and development, innovation vouchers, and joint grant research projects

Equipment

• Complete portfolio of National Instruments development software tools (LabVIEW, TestStand, etc.)
• RATS universal modular test platform, featuring:
• Signal conditioning and interface modules for external data signals (60 V DC, 500 mA DC)
• Configurable backplane supporting 300 data signals (60 V DC, 500 mA DC) and a shared 3-wire power bus (275 V DC / 40 A)
• Fault insertion / error simulation modules (short circuits, disconnections, voltage sags, and dropouts) up to 275 V / 20 A
• Universal matrix relay modules with 4×32 (128) relays (60 V DC, 500 mA DC)
• Software driver libraries for .NET and LabVIEW

Services

• Development of specialized sensors with integrated intelligence (e.g., liquid and gas flow meters, dew point sensors, pixelated radiation detectors)
• Development of sensors for demanding and niche applications (high pressure, vacuum, wirelessly/contactlessly powered sensors, sensors for measurements on rotating machinery rotors)
• Flexible collaboration options: expert consultations, contract research and development, innovation vouchers, and joint grant research projects

Equipment

• MSOX91304A high-frequency oscilloscope: 13 GHz bandwidth / 4 channels, sampling rate up to 80 GSa/s (2 channels), low-level noise floor measurement of 1.30 mVrms @ 13 GHz / 50 mV/div; compliance testing suite for USB 2.0/3.0, Ethernet, and DDR
• Rohde & Schwarz ESPI7 EMI test receiver: frequency range: 10 Hz to 7 GHz, resolution: 0.01 Hz, integrated tracking generator and I/Q modulator
• Keysight 16854A 136-channel precision logic analyzer: sampling rate: 2.5 GHz / 5 GHz (full / half channel), memory depth: 256 M
• Keithley 2401 single-channel parametric DC SourceMeter: voltage resolution: 5 µV, current resolution: 50 pA, max output: 20 V / 1 A
• Keysight E4980A precision LCR meter: basic accuracy: 0.05%, frequency range: 20 Hz to 2 MHz
• Keysight 33600A dual-channel function / arbitrary waveform generator: bandwidth: 120 MHz, sampling rate: 1 GSa/s
• ESSEMTEC EXPERT-LINE UP3100 semi-automatic SMD pick-and-place station: equipped with an optical alignment prism for BGA placement
• Software Suite: Altium Designer, MATLAB, Intel Quartus Prime, Atollic, Code Composer Studio, SolidWorks

Services

• Development of specialized electronic devices for measurement, control, and regulation, optimized for low-volume production
• Mechanical design and engineering
• Device design finalization up to validated prototype stage, including full technical documentation and manufacturing data packages
• Assistance with setting up low-volume device manufacturing
• Design of analog circuits for signal processing and sensor signal conditioning
• Design of digital circuits based on FPGAs or embedded processors
• Software and firmware development for digital circuits
• Power supply circuit design
• Industrial and enclosure design of devices
• Front panel fabrication
• Flexible collaboration options: expert consultations, contract research and development, innovation vouchers, and joint grant research projects

Equipment

• MSOX91304A high-frequency oscilloscope: 13 GHz bandwidth / 4 channels, sampling rate up to 80 GSa/s (2 channels), low-level noise floor measurement of 1.30 mVrms @ 13 GHz / 50 mV/div; compliance testing suite for USB 2.0/3.0, Ethernet, and DDR
• Rohde & Schwarz ESPI7 EMI test receiver: frequency range: 10 Hz to 7 GHz, resolution: 0.01 Hz, integrated tracking generator and I/Q modulator
• Keysight 16854A 136-channel precision logic analyzer: sampling rate: 2.5 GHz / 5 GHz (full / half channel), memory depth: 256 M
• Keithley 2401 single-channel parametric DC SourceMeter: voltage resolution: 5 µV, current resolution: 50 pA, max output: 20 V / 1 A
• Keysight E4980A precision LCR meter: basic accuracy: 0.05%, frequency range: 20 Hz to 2 MHz
• Keysight 33600A dual-channel function / arbitrary waveform generator: bandwidth: 120 MHz, sampling rate: 1 GSa/s
• ESSEMTEC EXPERT-LINE UP3100 semi-automatic SMD pick-and-place station: equipped with an optical alignment prism for BGA placement
• Software Suite: Altium Designer, MATLAB, Intel Quartus Prime, Atollic, Code Composer Studio, SolidWorks

Services

• Hardware and software design for embedded applications, ranging from microcontrollers to PC-based systems
• Software driver development for embedded systems
• Development of comprehensive software solutions, including custom user interfaces tailored to specific applications
• Utilization of database systems for data storage, analysis, and visualization of controlled processes
• Deployment and implementation of internet technologies for remote access, monitoring, and data acquisition
• Application of buses and protocols for wired and wireless communications, incorporating data transmission security requirements
• Development of applications utilizing Real-Time Operating Systems (RTOS)

Equipment

• Application Development Toolchains for Assembly, C/C++, C#, and Java: Keil µVision, Atollic TrueSTUDIO, Microsoft Visual Studio, Code Composer Studio, Eclipse
• Database Platforms: MySQL, Microsoft SQL Server, Firebird, PostgreSQL, and others
• Hardware Development Platforms for 8-bit, 16-bit, and 32-bit microcontrollers based on proprietary architectures as well as ARM Cortex-M and Cortex-A cores
• Testing Hardware for high-performance systems based on Intel x86 and ARM architectures
• Wireless Communication Modules based on Bluetooth, Wi-Fi, LoRa, Zigbee, Nordic Semiconductor solutions, and various other protocols
• Microcontroller Development and Debugging Tools: Atmel-ICE, GDB debugger, SEGGER J-Link, ST-LINK, and others
• PLC-Based Control Systems and Phar Lap modules for real-time Windows extensions

Services

• Development of systems utilizing industrial communication protocols
• Development of systems utilizing automotive buses
• Implementation and analysis of communication buses for Ethernet, CAN, FlexRay, LIN, RS-485, RS-232, M-Bus specifications, etc.
• Implementation of higher-layer protocols for CAN (CANopen, TTCAN), Ethernet (TCP/IP), etc.
• Design of distributed control systems based on Industrial Ethernet
• Analysis and troubleshooting / issue localization in industrial communications
• Testing and analysis of bus networks regarding immunity to interference and communication reliability
• Selection and design of suitable industrial communication architectures
• Diagnostics of automotive bus systems
• System testing utilizing rest-bus simulation

Equipment

• Vector Informatik CANoe analysis and simulation software
• Agilent MSO7104A 4-channel oscilloscope (1 GHz bandwidth, 4 GSa/s sampling rate) with integrated 16-channel logic analyzer and protocol decoding/analysis for FlexRay, CAN, LIN, SPI, I²C, and UART/RS-232
• Agilent / Keysight 16802A 68-channel logic analyzer

Services

• Electronics development using modern components (DSP, FPGA, ASIC, etc.) in sensor, actuator, and diverse application systems
• Precision FPGA design with demanding requirements for signal processing performance and time-domain timing constraints
• Development of highly specialized electronics
• Simulation of digital, analog, and mixed-signal systems
• Development of radiation-hardened / radiation-tolerant electronics
• Development and consulting for electronics design regarding EMC (Electromagnetic Compatibility)
• Implementation of signal processing algorithms

Equipment

• MSOX91304A high-frequency oscilloscope: analog bandwidth: 13 GHz / 4 channels, sampling rate up to 80 GSa/s (2 channels), low-level noise floor measurement of 1.30 mVrms @ 13 GHz / 50 mV/div; compliance testing suite for USB 2.0/3.0, Ethernet, and DDR
• Rohde & Schwarz ESPI7 EMI test receiver: frequency range: 10 Hz to 7 GHz, resolution: 0.01 Hz, integrated tracking generator and I/Q modulator
• HP 4140B picoammeter: measurement range from ±0.001 pA to 0.2 mA
• Agilent 16822A logic analyzer: 68 channels, 4 GHz timing zoom, 64 K memory depth
• Keysight 16854A 136-channel precision logic analyzer: sampling rate: 2.5 GHz / 5 GHz (full / half channel), memory depth: 256 M
• Keysight 33600A dual-channel function / arbitrary waveform generator: bandwidth: 120 MHz, sampling rate: 1 GSa/s
• Software Suite: Altium Designer, MATLAB, PADS, VHDL-AMS

Services

• Single-piece and prototype soldering of all surface-mount package types (BGA, QFN, CSP, µSMD, etc.)
• Soldering of advanced processors (DSPs, FPGAs, ASICs, etc.), sensors, driver ICs, and passive components
• Precision fabrication of stencils/masks and placement fixtures for all package types with 0.01 mm accuracy
• Thermal profile analysis for package soldering and desoldering utilizing bottom IR preheating and thermocouple probes
• Thermal profile optimization according to chip manufacturer specifications
• Vision-guided / camera-assisted component placement on PCBs
• Rework and replacement of defective chips on fully assembled boards
• Assembly of prototype PCBs required during the development of custom and novel hardware systems
• Implementation of ISO 9000 standards across mechanical and electronic assembly processes, ensuring high repeatability and reliability

Equipment

• MARTIN-SMT rework and assembly station: Micro-pipette chip handling system, high-precision micro-positioning stage, optical vision alignment system with interchangeable lenses (BGA, CSP, MLP), hot air soldering unit, power-controlled bottom IR preheater, component reballing and refurbishment capabilities

Services

• Rapid fabrication of single-sided and double-sided non-plated-through (non-PTH) printed circuit boards (mechanical milling on FR-4 substrate using isolation milling techniques)
• Precision milling of specialized substrates (e.g., Teflon, Macor) for custom RF and specialized applications
• Milling and engraving of simple structural components and panels from aluminum sheet metal

Equipment

• LPKF ProtoMat S100 circuit board plotter / PCB milling machine (equipped with a vacuum holding table and optical camera alignment system)

Services

• KETcube: Modular hardware system (LPWAN communication, battery management, environmental sensors) with dedicated operating software, providing a universal development platform for IoT applications
• SmartCampus: Testing polygon/testbed for Smart City technologies operating under real-world conditions within the University of West Bohemia (ZČU) campus (e.g., smart parking, smart lighting, environmental sensing)
• Design, development, testing, functional, mechanical, and climatic testing, as well as upscaling of Smart City technologies (including smart parking, intelligent lighting, urban sensor systems, communication networks, and cloud storage)
• Smart Farming: IoT solutions for precision agriculture (e.g., remote monitoring of agricultural soil parameters across large land areas)
• Development of fire detection/sensing systems (e.g., ruggedized sensor modules for UAV/drone-based deployment in hazardous or hard-to-reach terrain)
• Design and prototyping of end devices for IoT networks (LoRaWAN, Sigfox, NB-IoT)
• Design and implementation of ultra-low-power electronic systems and wireless sensor networks (WSNs)
• Execution of collaborative projects and contract research in the Smart City and IoT domains
• Consulting and expert advisory services for Smart City and IoT applications

Equipment

• Professional hardware design suite (Altium Designer)
• Software development toolchains for embedded devices (compilers, IDEs)
• Mobile application development environments for Android and iOS platforms
• Smart City technology testbed/polygon on the university campus grounds (see www.smartcampus.cz)
• Prusa i3 MK3 3D printer for rapid prototyping
• Robodrone Kingfisher UAV for testing sensor systems designed for aerial mounting or drone delivery/deployment
• Testbed LoRaWAN IoT network covering the ZČU campus, integrated with the Pilsen LORATECH network
• Testbed fully scalable Smart Cloud platform for IoT and general data applications